UV laser marking
Classification:
Keyword:
Overview
High electro-optical conversion rate:high beam quality;very small spot,can achieve ultra-fine marking;longservice life;high positioning accuracy;high efficiency;modular design for easy installation and maintenance;high stability;small volume;low power consump.tion.
Product Details
| Type: LS-UVDB | Marking Depth: 0.01-0.5mm |
| Laser Power: 3W/5W/12W/15W | Electric Demand:220v/50hz/15a |
| Wave Length: 355nm | Repetition Rrequency: 20khz-200khz |
| MarkingAccuracy:±0.003mm | Marking Area: 105*105mm/145*145mm |
| Total Power: <500w | Total Size: 86*82*104cm |
| Minimum Line:0.01mm | Weight: 110kg |
| Marking Speed:7000mm/s | Cooling Mode:Air cooling/Water cooling |
| Beam quality: M2:1.5 |
APPLICATION AND MATERIALS
Application:The UV laser marking machine is mainly based on its unigue low-power laserbeam and suitable for the high-end market of ultra-fine processing.the bottle surface otcosmetics, pharmaceuticals, ornaments and other polymer materials marking,FlexiblePCB board marking, scribing:Silicon wafer microporous and blind hole processing:LCcliguid crvstal glass OR code marking, glassware surface punching, metal surface coatingcomponents,gifts,communicationsequipmentmarking,plastic keys,electronicconstruction materials.etc.
Materials: BUV laser marking machine is mainly used for marking and surface treatmentof various glass, TFT, LCD, plasma screen, textile, thin slice ceramics, monocrystallinesilicon,lC crystal,sapphire, polymer film and other materials.
Samples
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