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UV laser marking


Classification:

Keyword:

Asterisk: ZL-UVDB
Applications: The UV laser marking machine is mainly based on its unigue low-power laserbeam and suitable for the high-end market of ultra-fine processing.the bottle surface otcosmetics, pharmaceuticals, ornaments and other polymer materials marking,FlexiblePCB board marking, scribing:Silicon wafer microporous and blind hole processing:LCcliguid crvstal glass OR code marking, glassware surface punching, metal surface coatingcomponents,gifts,communicationsequipmentmarking,plastic keys,electronicconstruction materials.etc.

Overview

High electro-optical conversion rate:high beam quality;very small spot,can achieve ultra-fine marking;longservice life;high positioning accuracy;high efficiency;modular design for easy installation and maintenance;high stability;small volume;low power consump.tion.

Product Details

PRODUCT PARAMETERS

Type: LS-UVDB Marking Depth: 0.01-0.5mm
Laser Power: 3W/5W/12W/15W Electric Demand:220v/50hz/15a
Wave Length: 355nm Repetition Rrequency: 20khz-200khz
MarkingAccuracy:±0.003mm Marking Area: 105*105mm/145*145mm
Total Power: <500w Total Size: 86*82*104cm
Minimum Line:0.01mm Weight: 110kg
Marking Speed:7000mm/s Cooling Mode:Air cooling/Water cooling
Beam quality: M2:1.5  

 

APPLICATION AND MATERIALS

Application:The UV laser marking machine is mainly based on its unigue low-power laserbeam and suitable for the high-end market of ultra-fine processing.the bottle surface otcosmetics, pharmaceuticals, ornaments and other polymer materials marking,FlexiblePCB board marking, scribing:Silicon wafer microporous and blind hole processing:LCcliguid crvstal glass OR code marking, glassware surface punching, metal surface coatingcomponents,gifts,communicationsequipmentmarking,plastic keys,electronicconstruction materials.etc.

Materials: BUV laser marking machine is mainly used for marking and surface treatmentof various glass, TFT, LCD, plasma screen, textile, thin slice ceramics, monocrystallinesilicon,lC crystal,sapphire, polymer film and other materials.

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